{"containers":{"cna":{"affected":[{"product":"Snapdragon Auto","vendor":"Qualcomm, Inc.","versions":[{"status":"affected","version":"MDM9628, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6696, SA6155, SA6155P, SA8150P, SA8155, SA8155P, SA8195P"}]}],"descriptions":[{"lang":"en","value":"Improper handling of sensor HAL structure in absence of sensor can lead to use after free in Snapdragon Auto"}],"metrics":[{"cvssV3_1":{"attackComplexity":"LOW","attackVector":"LOCAL","availabilityImpact":"HIGH","baseScore":8.4,"baseSeverity":"HIGH","confidentialityImpact":"HIGH","integrityImpact":"HIGH","privilegesRequired":"NONE","scope":"UNCHANGED","userInteraction":"NONE","vectorString":"CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H","version":"3.1"}}],"problemTypes":[{"descriptions":[{"description":"Use After Free in Sensor Hardware Abstraction Layer","lang":"en","type":"text"}]}],"providerMetadata":{"dateUpdated":"2021-10-20T06:31:53.000Z","orgId":"2cfc7d3e-20d3-47ac-8db7-1b7285aff15f","shortName":"qualcomm"},"references":[{"tags":["x_refsource_CONFIRM"],"url":"https://www.qualcomm.com/company/product-security/bulletins/october-2021-bulletin"}],"x_legacyV4Record":{"CVE_data_meta":{"ASSIGNER":"product-security@qualcomm.com","ID":"CVE-2021-30315","STATE":"PUBLIC"},"affects":{"vendor":{"vendor_data":[{"product":{"product_data":[{"product_name":"Snapdragon Auto","version":{"version_data":[{"version_value":"MDM9628, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6696, SA6155, SA6155P, SA8150P, SA8155, SA8155P, SA8195P"}]}}]},"vendor_name":"Qualcomm, Inc."}]}},"data_format":"MITRE","data_type":"CVE","data_version":"4.0","description":{"description_data":[{"lang":"eng","value":"Improper handling of sensor HAL structure in absence of sensor can lead to use after free in Snapdragon Auto"}]},"impact":{"cvss":{"baseScore":8.4,"vectorString":"CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H","version":"3.1"}},"problemtype":{"problemtype_data":[{"description":[{"lang":"eng","value":"Use After Free in Sensor Hardware Abstraction Layer"}]}]},"references":{"reference_data":[{"name":"https://www.qualcomm.com/company/product-security/bulletins/october-2021-bulletin","refsource":"CONFIRM","url":"https://www.qualcomm.com/company/product-security/bulletins/october-2021-bulletin"}]}}},"adp":[{"providerMetadata":{"orgId":"af854a3a-2127-422b-91ae-364da2661108","shortName":"CVE","dateUpdated":"2024-08-03T22:32:41.076Z"},"title":"CVE Program Container","references":[{"tags":["x_refsource_CONFIRM","x_transferred"],"url":"https://www.qualcomm.com/company/product-security/bulletins/october-2021-bulletin"}]}]},"cveMetadata":{"assignerOrgId":"2cfc7d3e-20d3-47ac-8db7-1b7285aff15f","assignerShortName":"qualcomm","cveId":"CVE-2021-30315","datePublished":"2021-10-20T06:31:53.000Z","dateReserved":"2021-04-07T00:00:00.000Z","dateUpdated":"2024-08-03T22:32:41.076Z","state":"PUBLISHED"},"dataType":"CVE_RECORD","dataVersion":"5.1"}