{"containers":{"cna":{"affected":[{"product":"Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking","vendor":"Qualcomm, Inc.","versions":[{"status":"affected","version":"APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, IPQ6018, IPQ8074, Kamorta, MDM9150, MDM9205, MDM9206, MDM9607, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCN7605, QCS404, QCS405, QCS605, QCS610, QM215, Rennell, SA415M, SA515M, SA6155P, SC7180, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130"}]}],"descriptions":[{"lang":"en","value":"u'Lack of check for integer overflow for round up and addition operations result into memory corruption and potential information leakage' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, IPQ6018, IPQ8074, Kamorta, MDM9150, MDM9205, MDM9206, MDM9607, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCN7605, QCS404, QCS405, QCS605, QCS610, QM215, Rennell, SA415M, SA515M, SA6155P, SC7180, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130"}],"problemTypes":[{"descriptions":[{"description":"Integer Overflow or Wraparound in Qualcomm IPC","lang":"en","type":"text"}]}],"providerMetadata":{"dateUpdated":"2020-09-08T09:31:29.000Z","orgId":"2cfc7d3e-20d3-47ac-8db7-1b7285aff15f","shortName":"qualcomm"},"references":[{"tags":["x_refsource_CONFIRM"],"url":"https://www.qualcomm.com/company/product-security/bulletins/august-2020-bulletin"}],"x_legacyV4Record":{"CVE_data_meta":{"ASSIGNER":"product-security@qualcomm.com","ID":"CVE-2019-13999","STATE":"PUBLIC"},"affects":{"vendor":{"vendor_data":[{"product":{"product_data":[{"product_name":"Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking","version":{"version_data":[{"version_value":"APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, IPQ6018, IPQ8074, Kamorta, MDM9150, MDM9205, MDM9206, MDM9607, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCN7605, QCS404, QCS405, QCS605, QCS610, QM215, Rennell, SA415M, SA515M, SA6155P, SC7180, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130"}]}}]},"vendor_name":"Qualcomm, Inc."}]}},"data_format":"MITRE","data_type":"CVE","data_version":"4.0","description":{"description_data":[{"lang":"eng","value":"u'Lack of check for integer overflow for round up and addition operations result into memory corruption and potential information leakage' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, IPQ6018, IPQ8074, Kamorta, MDM9150, MDM9205, MDM9206, MDM9607, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCN7605, QCS404, QCS405, QCS605, QCS610, QM215, Rennell, SA415M, SA515M, SA6155P, SC7180, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130"}]},"problemtype":{"problemtype_data":[{"description":[{"lang":"eng","value":"Integer Overflow or Wraparound in Qualcomm IPC"}]}]},"references":{"reference_data":[{"name":"https://www.qualcomm.com/company/product-security/bulletins/august-2020-bulletin","refsource":"CONFIRM","url":"https://www.qualcomm.com/company/product-security/bulletins/august-2020-bulletin"}]}}},"adp":[{"providerMetadata":{"orgId":"af854a3a-2127-422b-91ae-364da2661108","shortName":"CVE","dateUpdated":"2024-08-05T00:05:44.146Z"},"title":"CVE Program Container","references":[{"tags":["x_refsource_CONFIRM","x_transferred"],"url":"https://www.qualcomm.com/company/product-security/bulletins/august-2020-bulletin"}]}]},"cveMetadata":{"assignerOrgId":"2cfc7d3e-20d3-47ac-8db7-1b7285aff15f","assignerShortName":"qualcomm","cveId":"CVE-2019-13999","datePublished":"2020-09-08T09:31:29.000Z","dateReserved":"2019-07-19T00:00:00.000Z","dateUpdated":"2024-08-05T00:05:44.146Z","state":"PUBLISHED"},"dataType":"CVE_RECORD","dataVersion":"5.1"}